The initial die or basic chip building block 3D XPoint implementation is a layer 128 Gbit device which if using 8 bits would yield 16GB raw. Over time increased densities should become available as the bit density improves with more cells and further scaling of the technology, combined with packaging. For example while a current die could hold up to 16 GBytes of data, multiple dies could be packaged together to create a 32GB, 64GB, 128GB etc. or larger actual product. Think about not only where packaged flash based SSD capacities are today, also think in terms of where DDR3 and DDR4 DIMM are at such as 4GB, 8GB, 16GB, 32GB densities.
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